TSMC reportedly weighs 20% CoWoS price increase as Nvidia Blackwell and Rubin chips put pressure on packaging capacity

TSMC is reportedly weighing a price increase of up to 20% for its CoWoS advanced packaging technology as Nvidia’s Blackwell and upcoming Rubin chips intensify pressure on capacity. Equipment deliveries now reportedly take up to eight months, while separate wafer-price increases of 5% to 10% are expected in 2027, with some customers potentially facing total cost increases of up to 25%.

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