The Exynos 2500 was not ready in time for the Galaxy S25 series, but Samsung has put the finishing touches on it and made it official – just in time for the Galaxy Z Flip7, which will debut on July 9.
The Exynos 2500 is fabbed on Samsung’s latest 3nm Gate All Around (GAA) node for improved power efficiency and uses new packaging – Fan-Out Wafer-Level Packaging or FOWLP. This allows for a reduced chip thickness and improved heat dissipation.
The CPU is a 10-core (deca-core) design with what Samsung calls a 1+7+2 arrangement. In reality, it is 1+2+5+2 as the mid-cores are split into two…